LED packaging structure provided with glass cover

具有玻璃盖的led封装结构

Abstract

本实用新型涉及一种具有玻璃盖的LED封装结构。其包括基板,基板上设有印刷电路板;印刷电路板的中心区凹设有定位槽,定位槽内设有电源控制芯片;电源控制芯片上设置均匀分布的LED芯片;电源控制芯片的表面对应于LED芯片的两侧均设有芯片连接端;LED芯片的电源端通过连接导线、芯片连接端与电源控制芯片电性连接;印刷电路板上设有固定连接的挡墙;挡墙内填充有光学硅胶,光学硅胶填充在定位槽内,并覆盖于印刷电路板与电源控制芯片的表面;挡墙对应于与印刷电路板相接触的另一端设有玻璃盖;所述印刷电路板上还设有电源连接端,所述电源连接端与电源控制芯片电性连接。本实用新型适用性好,操作方便,节能环保,发光亮度高及使用寿命长。
The utility model relates to a LED packaging structure provided with a glass cover which includes a substrate; a printed circuit board is arranged on the substrate; the center area of the printed circuit board is concavely provided with a locating slot; a power control chip is arranged in the locating slot; LED chips are uniformly arranged on the power control chip; the surface of the power control chip is provided with chip connecting ends corresponding to the two sides of the LED chips; the power ends of the LED chips are electrically connected with the power control chips through connecting wires and the chip connecting ends; barricades which are fixedly connected are arranged on the printed circuit board; the insides of the barricades are filled by optical silica gel; and the optical silica gel is filled in the locating slot and is covered on the surface of the printed circuit board and the power control chip; the barricades are provided with a glass cover corresponding to the other end contacted with the printed circuit board; a power connecting end is also arranged on the printed circuit board; and the power connecting end is electrically connected with the power control chip. The LED packaging structure provided with the glass cover has the advantages of good applicability, convenient operation, energy saving and environmental protection, high luminosity and long service life.

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Cited By (8)

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    CN-102705734-AOctober 03, 2012深圳市瑞丰光电子股份有限公司LED (light-emitting diode) light source module and straight down type LED panel light
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    CN-103582282-AFebruary 12, 2014欧司朗股份有限公司Circuit board and electronic module and light-emitting module comprising same
    CN-104066676-ASeptember 24, 2014大陆汽车系统公司Thin semiconductor die package
    CN-104066676-BSeptember 21, 2016大陆汽车系统公司薄半导体芯片封装
    CN-104300067-BNovember 10, 2017立碁电子工业股份有限公司可挠式led封装